TE Connectivity plc (TEL) Dividend Yield, History & Forecast

TE Connectivity plc (TEL) is a Semiconductors company in the Technology sector listed on the New York Stock Exchange. It pays a current dividend yield of 1.42% ($2.91 per share annually (TTM)), with 15 years of consecutive dividend increases. The most recent ex-dividend date was August 21, 2026, with payment scheduled for September 11, 2026. The trailing twelve-month payout ratio is 28.2%; the market capitalization is approximately $59.64B.

Loading quote...

Frequently Asked Questions about TE Connectivity plc (TEL)

What is TE Connectivity plc's dividend yield?
TE Connectivity plc (TEL) pays a current trailing twelve-month dividend yield of 1.42%, which works out to $2.91 per share annually based on the most recent payout schedule.
When does TE Connectivity plc pay its next dividend?
The most recent ex-dividend date was August 21, 2026. The next scheduled dividend payment date is September 11, 2026.
How many years has TE Connectivity plc increased its dividend?
TE Connectivity plc (TEL) has increased its dividend for 15 consecutive years.
Is TE Connectivity plc a Dividend Aristocrat?
No. Dividend Aristocrat status requires an S&P 500 listing and 25 or more consecutive years of dividend increases. TE Connectivity plc (TEL) currently has 15 years of consecutive increases.
What sector is TE Connectivity plc in?
TE Connectivity plc (TEL) operates in the Technology sector, specifically the Semiconductors industry.
What is TE Connectivity plc's dividend payout ratio?
TE Connectivity plc (TEL)'s trailing twelve-month dividend payout ratio is 28.2%. The payout ratio measures what percentage of earnings is paid out as dividends — a lower ratio generally suggests a more sustainable dividend.