HEICO Corporation (HEI-A) Dividend Yield, History & Forecast

HEICO Corporation (HEI-A) is an Aerospace & Defense company in the Industrials sector listed on the New York Stock Exchange. It pays a current dividend yield of 0.08% ($0.25 per share annually (TTM)), with 11 years of consecutive dividend increases. The most recent ex-dividend date was July 1, 2026, with payment scheduled for July 15, 2026. The trailing twelve-month payout ratio is 4.1%; the market capitalization is approximately $45.31B. Review HEI-A dividend history on this scorecard, compare peers in the Compare Dividend Returns tool, or project income with the dividend calculator.

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Frequently Asked Questions about HEICO Corporation (HEI-A)

What is HEICO Corporation's dividend yield?
HEICO Corporation (HEI-A) pays a current trailing twelve-month dividend yield of 0.08%, which works out to $0.25 per share annually based on the most recent payout schedule.
When does HEICO Corporation pay its next dividend?
The most recent ex-dividend date was July 1, 2026. The next scheduled dividend payment date is July 15, 2026.
How many years has HEICO Corporation increased its dividend?
HEICO Corporation (HEI-A) has increased its dividend for 11 consecutive years.
Is HEICO Corporation a Dividend Aristocrat?
No. Dividend Aristocrat status requires an S&P 500 listing and 25 or more consecutive years of dividend increases. HEICO Corporation (HEI-A) currently has 11 years of consecutive increases.
What sector is HEICO Corporation in?
HEICO Corporation (HEI-A) operates in the Industrials sector, specifically the Aerospace & Defense industry.
What is HEICO Corporation's dividend payout ratio?
HEICO Corporation (HEI-A)'s trailing twelve-month dividend payout ratio is 4.1%. The payout ratio measures what percentage of earnings is paid out as dividends — a lower ratio generally suggests a more sustainable dividend.