HEICO Corporation (HEI) Dividend Yield, History & Forecast

HEICO Corporation (HEI) is an Aerospace & Defense company in the Industrials sector listed on the New York Stock Exchange. It pays a current dividend yield of 0.04% ($0.12 per share annually (TTM)), with 8 years of consecutive dividend increases. The most recent ex-dividend date was July 1, 2026, with payment scheduled for July 15, 2026. The trailing twelve-month payout ratio is 4.2%; the market capitalization is approximately $37.82B.

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Frequently Asked Questions about HEICO Corporation (HEI)

What is HEICO Corporation's dividend yield?
HEICO Corporation (HEI) pays a current trailing twelve-month dividend yield of 0.04%, which works out to $0.12 per share annually based on the most recent payout schedule.
When does HEICO Corporation pay its next dividend?
The most recent ex-dividend date was July 1, 2026. The next scheduled dividend payment date is July 15, 2026.
How many years has HEICO Corporation increased its dividend?
HEICO Corporation (HEI) has increased its dividend for 8 consecutive years.
Is HEICO Corporation a Dividend Aristocrat?
No. Dividend Aristocrat status requires an S&P 500 listing and 25 or more consecutive years of dividend increases. HEICO Corporation (HEI) currently has 8 years of consecutive increases.
What sector is HEICO Corporation in?
HEICO Corporation (HEI) operates in the Industrials sector, specifically the Aerospace & Defense industry.
What is HEICO Corporation's dividend payout ratio?
HEICO Corporation (HEI)'s trailing twelve-month dividend payout ratio is 4.2%. The payout ratio measures what percentage of earnings is paid out as dividends — a lower ratio generally suggests a more sustainable dividend.