Obra High Grade Structured Products ETF (OGSP) Dividend Yield, History & Forecast

Obra High Grade Structured Products ETF (OGSP) is an exchange-traded fund (ETF) listed on the New York Stock Exchange Arca. The most recent ex-dividend date was May 28, 2026, with payment scheduled for May 29, 2026. market capitalization is approximately $29M.

Frequently Asked Questions about Obra High Grade Structured Products ETF (OGSP)

When does Obra High Grade Structured Products ETF pay distributions?
The most recent ex-dividend date was May 28, 2026. The next scheduled dividend payment date is May 29, 2026.
How many years has Obra High Grade Structured Products ETF increased its dividend?
Obra High Grade Structured Products ETF (OGSP) has increased its dividend for 1 consecutive year.
What does Obra High Grade Structured Products ETF invest in?
OGSP offers global exposure to investment grade securitized products through an active, opportunity-oriented approach. The fund invests across capital structures, maturity, and duration, based on the advisers assessment of market conditions. The portfolio may include asset-backed securities, collateralized debt, mortgage, and loan obligations, agency and non-agency mortgage-backed securities, and other instruments secured by financial, physical, or intangible assets. The portfolio will not focus on specific tranches or asset categories. The adviser uses a combination of fundamental,...