SEI High Yield Bond & Alternative Credit ETF (LEND) is an exchange-traded fund (ETF) listed on the NASDAQ Global Select. It pays a current dividend yield of 2.06% ($0.51 per share annually (TTM)). The most recent ex-dividend date was September 3, 2026, with payment scheduled for September 4, 2026. market capitalization is approximately $1.02B. Review LEND dividend history on this scorecard, compare peers in the Compare Dividend Returns tool, or project income with the dividend calculator.
LEND holds 1432 positions, with 0.5% of assets in its ten largest. It charges an expense ratio of 0.65%, and manages $1.01B.