SEI High Yield Bond & Alternative Credit ETF (LEND) Dividend Yield, History & Forecast

SEI High Yield Bond & Alternative Credit ETF (LEND) is an exchange-traded fund (ETF) listed on the NASDAQ Global Market. It pays a current dividend yield of 1.55% ($0.39 per share annually (TTM)). The most recent ex-dividend date was August 5, 2026, with payment scheduled for August 6, 2026. market capitalization is approximately $1.03B.

LEND fund composition

It charges an expense ratio of 0.65%, and manages $1.03B.

Sector allocation

Energy57.9%Real Estate13.6%Communication Services12.8%Industrials10.8%Technology3.6%Healthcare1.3%

Frequently Asked Questions about SEI High Yield Bond & Alternative Credit ETF (LEND)

What is SEI High Yield Bond & Alternative Credit ETF's dividend yield?
SEI High Yield Bond & Alternative Credit ETF (LEND) pays a current trailing twelve-month dividend yield of 1.55%, which works out to $0.39 per share annually based on the most recent payout schedule.
When does SEI High Yield Bond & Alternative Credit ETF pay distributions?
The most recent ex-dividend date was August 5, 2026. The next scheduled dividend payment date is August 6, 2026.
What does SEI High Yield Bond & Alternative Credit ETF invest in?
This fund is mandated to commit a significant portion of its assets – at least 80% of its net capital, including any funds raised through borrowing – to high-yield debt instruments. Its primary focus is on fixed income securities rated below investment grade, colloquially known as "junk bonds." This encompasses a broad range of credit products, such as corporate bonds, debentures, hybrid securities like convertible and preferred shares, zero-coupon obligations, and various tranches of structured credit vehicles including Collateralized Debt Obligations (CDOs) and Collateralized Loan...