SEI High Yield Bond & Alternative Credit ETF (LEND) Dividend Yield, History & Forecast

SEI High Yield Bond & Alternative Credit ETF (LEND) is an exchange-traded fund (ETF) listed on the NASDAQ Global Market. The most recent ex-dividend date was December 30, 2019, with payment scheduled for January 2, 2020. market capitalization is approximately $1.04B.

Frequently Asked Questions about SEI High Yield Bond & Alternative Credit ETF (LEND)

When does SEI High Yield Bond & Alternative Credit ETF pay distributions?
The most recent ex-dividend date was December 30, 2019. The next scheduled dividend payment date is January 2, 2020.
What does SEI High Yield Bond & Alternative Credit ETF invest in?
This fund is mandated to commit a significant portion of its assets – at least 80% of its net capital, including any funds raised through borrowing – to high-yield debt instruments. Its primary focus is on fixed income securities rated below investment grade, colloquially known as "junk bonds." This encompasses a broad range of credit products, such as corporate bonds, debentures, hybrid securities like convertible and preferred shares, zero-coupon obligations, and various tranches of structured credit vehicles including Collateralized Debt Obligations (CDOs) and Collateralized Loan...
SEI High Yield Bond & Alternative Credit ETF (LEND) Dividend Yield, History & Forecast